Substrate processing method, substrate processing system,...

Details Substrate processing method, substrate processing system,... Substrate processing method, substrate processing system,...

2007-12-18

2011-12-27

Vinh, Lan (Department: 1713)

Etching a substrate: processes

Masking of a substrate using material resistant to an etchant

C216S040000, C134S001200, C438S716000

Reexamination Certificate

active

08083959

ABSTRACT:
In the present invention, a plurality of rounds of patterning are performed on a substrate. In a patterning system, the substrate on which a first round of patterning has been performed is transferred to a planarizing film forming unit, where a planarizing film is formed above the substrate. The substrate is then transferred to the patterning system and subjected to a second round of patterning. The time from the completion of the forming processing of the planarizing film to the start of the second round of patterning is managed to be constant among the substrates. According to the present invention, in the pattern forming processing of performing a plurality of rounds of patterning, a pattern with a desired dimension can be stably formed above the substrate.

REFERENCES:
patent: 6519498 (2003-02-01), Jevtic et al.
patent: 6930061 (2005-08-01), Cheung et al.
patent: 2007/0003878 (2007-01-01), Paxton et al.
patent: 6-104170 (1994-04-01), None
patent: 6-318541 (1994-11-01), None
patent: 7-147219 (1995-06-01), None
patent: 8-222543 (1996-08-01), None
Japanese Office Action issued Apr. 5, 2011, in Patent Application No. 2006-351555 (with English-language translation).

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