Substrate processing method, substrate processing system,...

Details Substrate processing method, substrate processing system,... Substrate processing method, substrate processing system,...

2011-07-12

2011-07-12

Walke, Amanda C. (Department: 1722)

Radiation imagery chemistry: process, composition, or product th

Plural exposure steps

C430S330000, C430S331000, C430S311000

Reexamination Certificate

active

07977038

ABSTRACT:
In the present invention, the position of a substrate on a thermal plate is detected when baking after exposure is performed in a first round of patterning. In a second round of patterning, the setting position of the substrate is adjusted based on a detection result of the position before the substrate is mounted on the thermal plate in the baking after exposure. In the baking after exposure in the second round of patterning, the substrate is mounted at the same position with respect to the thermal plate as that in the baking after exposure in the first round of patterning. In performing a plurality of rounds of patterning on a film to be processed, a pattern with a desired dimension is finally formed above the substrate, and the uniformity of the pattern dimension within the substrate is ensured.

REFERENCES:
patent: 6002108 (1999-12-01), Yoshioka
patent: 6318948 (2001-11-01), Ueda et al.
patent: 6790681 (2004-09-01), Matsunaga et al.
patent: 7256873 (2007-08-01), Finders et al.
patent: 7326505 (2008-02-01), Raulea
patent: 7563043 (2009-07-01), Kaneko et al.
patent: 2004/0101790 (2004-05-01), Cauchi et al.
patent: 2005/0200818 (2005-09-01), Ryu et al.
patent: 4-84413 (1992-03-01), None
patent: 06-104170 (1994-04-01), None
patent: 7-147219 (1995-06-01), None
patent: 2000-138158 (2000-05-01), None
patent: 2005-123651 (2005-05-01), None
Office Action issued Apr. 5, 2011, in Japanese Application No. 2006-344571 (with English translation), filed Dec. 21, 2006.

Affiliated with

Also associated with

Rating

Substrate processing method, substrate processing system,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate processing method, substrate processing system,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate processing method, substrate processing system,... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2642989