Substrate processing method, substrate processing apparatus,...

Details Substrate processing method, substrate processing apparatus,... Substrate processing method, substrate processing apparatus,...

2007-10-04

2011-10-25

MacArthur, Sylvia R. (Department: 1716)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

For liquid etchant

C156S345330

Reexamination Certificate

active

08043469

ABSTRACT:
At first, with a chamber being filled with a first gas, a process liquid is supplied onto a surface of a wafer in the chamber so as to process the surface of the wafer. At this time, the process liquid discharged from the chamber is returned to a process-liquid supplying part. Thereafter, with the chamber being filled with a second gas whose humidity is lower than that of the first gas, a fluid for forming a liquid film is supplied onto the surface of the wafer in the chamber to form a liquid film on the surface of the wafer and to dry the surface of the wafer.

REFERENCES:
patent: 5882433 (1999-03-01), Ueno
patent: 5882466 (1999-03-01), Grootaert et al.
patent: 6004047 (1999-12-01), Akimoto et al.
patent: 6092937 (2000-07-01), Snodgrass et al.
patent: 6247479 (2001-06-01), Taniyama et al.
patent: 6333275 (2001-12-01), Mayer et al.
patent: 6415803 (2002-07-01), Sundin et al.
patent: 6491764 (2002-12-01), Mertens et al.
patent: 6834440 (2004-12-01), Lee
patent: 6863741 (2005-03-01), Orii et al.
patent: 6938626 (2005-09-01), Inagaki
patent: 7543593 (2009-06-01), Orii et al.
patent: 7806989 (2010-10-01), Sekiguchi et al.
patent: 2001/0004878 (2001-06-01), Sakai et al.
patent: 2002/0007844 (2002-01-01), Orii et al.
patent: 2005/0115671 (2005-06-01), Araki
patent: 2007/0131256 (2007-06-01), Nanba et al.
patent: 2007/0223342 (2007-09-01), Orii et al.
patent: 2008/0093340 (2008-04-01), Nakamori et al.
patent: 2009/0014033 (2009-01-01), Tokuno et al.
patent: 11 2007 000442 (2009-02-01), None
patent: 1 801 860 (2007-06-01), None
patent: 02-046728 (1990-02-01), None
patent: 04-179227 (1992-06-01), None
patent: 6-9130 (1994-02-01), None
patent: 9-22891 (1997-01-01), None
patent: 9-038595 (1997-02-01), None
patent: 09-069488 (1997-03-01), None
patent: 9-293702 (1997-11-01), None
patent: 11-233481 (1999-08-01), None
patent: 2000-058498 (2000-02-01), None
patent: 2001-053051 (2001-02-01), None
patent: 2002-057088 (2002-02-01), None
patent: 2002-110612 (2002-04-01), None
patent: 2003-197590 (2003-07-01), None
patent: 2003-229404 (2003-08-01), None
patent: 2005-159191 (2005-06-01), None
patent: 2006-269668 (2006-10-01), None
patent: WO 03/007348 (2003-01-01), None
patent: WO 2005/050724 (2005-06-01), None
patent: 2006/041077 (2006-04-01), None
patent: WO2006041077 (2006-04-01), None
Machine Generated English Translation of the Abstract of WP 2006/041077 published Apr. 20, 2006.
Notification of Reasons for Rejection of Japanese Application No. 2006-540941, mailed Jan. 23, 2009.
Supplementary European Search Report for Application No. EP 05 79 3595 issued Jul. 14, 2009.
International Search Report ( PCT/ISA/210) in PCT/JP2006/306534, dated Jun. 27, 2006.
PCT Notification of Transmittal of Translation of the International Preliminary Examination Report (Form PCT/IB/338), for PCT/JP2005/018770, dated Apr. 26, 2007.
PCT International Preliminary Report on Patentability (Form PCT/IB/373) in PCT/JP2005/018770, with English Translation, dated Apr. 17, 2007.
Machine Generated Translation of JP 2002-057088, figure 1, published Feb. 22, 2002.
Japanese Office Action issued on May 14, 2009 for Japanese Patent Application No. 2005-380090 with English translation.
Japanese Office Action issued on Jan. 19, 2010 for Japanese Patent Application No. 2005-380090 with English translation.
PCT Second and Supplementary Notice Informing Applicant of Communication of International Application (Form PCT/IB/308) in PCT/JP05/018770, dated Feb. 15, 2007.
Notification of Transmittal of Translation of the International Preliminary Report on Patentability (Form PCT/IB/338) in PCT/JP2005/018770, dated Apr. 26, 2007.
PCT Written Opinion of the International Searching Authority (Form/ISA/237), for PCT/JP2005/018770, with English translation, dated Jan. 10, 2006.
Office Action for U.S. Appl. No. 11/578,099, dated Oct. 19, 2010.
Japanese Office Action issued on Jul. 15, 2011 for Application No. 2007-215753 w/ English language translation.

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