Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...
Reexamination Certificate
2004-12-07
2010-06-08
Barr, Michael (Department: 1792)
Cleaning and liquid contact with solids
Processes
Including application of electrical radiant or wave energy...
C134S026000, C134S030000
Reexamination Certificate
active
07731799
ABSTRACT:
A substrate processing method which removes an ArF resist film from a wafer having the ArF resist film. As an ultraviolet irradiation process is performed on the ArF resist film, and then an ozone gas and water vapor are fed to the ArF resist film, the ArF resist film is altered in a water-soluble state. Thereafter, the ArF resist film is removed from the substrate by feeding pure water to the ArF resist film altered into the water-soluble state.
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Iino Tadashi
Nakamori Mitsunori
Orii Takehiko
Saito Yusuke
Toshima Takayuki
Barr Michael
Coleman Ryan
Tokyo Electron Limited
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