Substrate processing method, substrate processing apparatus...

Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...

Reexamination Certificate

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C134S026000, C134S030000

Reexamination Certificate

active

07731799

ABSTRACT:
A substrate processing method which removes an ArF resist film from a wafer having the ArF resist film. As an ultraviolet irradiation process is performed on the ArF resist film, and then an ozone gas and water vapor are fed to the ArF resist film, the ArF resist film is altered in a water-soluble state. Thereafter, the ArF resist film is removed from the substrate by feeding pure water to the ArF resist film altered into the water-soluble state.

REFERENCES:
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patent: 2001/0004898 (2001-06-01), Kamikawa et al.
patent: 2002/0185225 (2002-12-01), Toshima et al.
patent: 2003/0170949 (2003-09-01), Chouno et al.
patent: 2001-223206 (2001-08-01), None
patent: 2002-18379 (2002-01-01), None
patent: 2002-134401 (2002-05-01), None
patent: 2002-184741 (2002-06-01), None
patent: 2002-231696 (2002-08-01), None
patent: 2003-273085 (2003-09-01), None
patent: 2003-332322 (2003-11-01), None

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