Metal working – Barrier layer or semiconductor device making – Barrier layer device making
Reexamination Certificate
2006-06-13
2006-06-13
Schillinger, Laura M. (Department: 2813)
Metal working
Barrier layer or semiconductor device making
Barrier layer device making
C118S301000
Reexamination Certificate
active
07060115
ABSTRACT:
The present invention is a method of performing processing for a substrate including the step of carrying the substrate, which has been pre-treated, to a heat treatment unit for heating the substrate, prior to supplying a treatment solution to the substrate to perform solution treatment, in which the carrying is performed such as to fix a period after the pretreatment for the substrate is completed and before it is carried to the heat treatment unit. According to the present invention, for example, in a lithography process, the substrate is carried such as to fix the period after exposure processing that is the pretreatment and before the substrate is carried to the heat treatment unit where heat treatment that is the following treatment is performed, whereby the degrees of chemical reaction of coating films by the exposure processing become uniform between the substrates.
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Hashiguchi Hiroharu
Okamura Kouji
Doty Heather A.
Schillinger Laura M.
Tokyo Electron Limited
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