Substrate processing method, substrate processing apparatus,...

Details Substrate processing method, substrate processing apparatus,... Substrate processing method, substrate processing apparatus,...

2008-04-08

2008-04-08

Deo, Duy-Vu N (Department: 1792)

Semiconductor device manufacturing: process

Chemical etching

Liquid phase etching

C438S747000, C438S748000, C438S749000, C438S750000

Reexamination Certificate

active

07354869

ABSTRACT:
A method for a substrate processing apparatus having a substrate holding mechanism and a chemical solution dispensing/sucking mechanism including a chemical solution dispensing port for supplying a first chemical solution and a chemical solution suction port, includes placing the target substrate on the substrate holding mechanism, laying out an auxiliary plate at a periphery of the substrate such that the two main faces are substantially flush with each other, supplying a second chemical solution onto the main faces, dispensing the first solution from the dispensing port and sucking the first and second solutions through the suction port, with the dispensing and suction ports brought into contact with the second solution, and while dispensing the first solution from the dispensing port and sucking the first solution through the suction port, scanning the dispensing/sucking mechanism such that the dispensing and suction ports are opposed to the main face of the substrate.

REFERENCES:
patent: 6550990 (2003-04-01), Sakurai et al.
patent: 2002/0081118 (2002-06-01), Sakurai et al.
patent: 2004/0106072 (2004-06-01), Itoh et al.
patent: 2002-252167 (2002-09-01), None

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