Substrate processing method, program, computer-readable...

Details Substrate processing method, program, computer-readable... Substrate processing method, program, computer-readable...

2011-08-30

2011-08-30

Young, Christopher G (Department: 1721)

Radiation imagery chemistry: process, composition, or product th

Including control feature responsive to a test or measurement

C430S311000, C430S322000, C430S330000, C356S636000, C438S007000

Reexamination Certificate

active

08007968

ABSTRACT:
In the present invention, patterning for the first time is performed on a film to be worked above the front surface of a substrate, and the actual dimension of the pattern formed by the patterning for the first time is measured. Based on the dimension measurement result of the patterning or the first time, the condition of patterning for the second time is then set. In this event, the condition of the patterning for the second time is set so that a difference between the dimension of the patterning for the first time and its target dimension is equal to a difference between the dimension of the patterning for the second time and its target dimension. Thereafter, the patterning for the second time is performed under the set patterning condition.

REFERENCES:
patent: 7 147219 (1995-06-01), None
patent: 7 211630 (1995-08-01), None
patent: 2004 95618 (2004-03-01), None

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