Substrate processing method, computer-readable storage...

Details Substrate processing method, computer-readable storage... Substrate processing method, computer-readable storage...

2011-07-26

2011-07-26

Young, Christopher G (Department: 1721)

Radiation imagery chemistry: process, composition, or product th

Including control feature responsive to a test or measurement

C430S330000, C382S145000, C382S146000

Reexamination Certificate

active

07985516

ABSTRACT:
A processing temperature of thermal processing is corrected based on measurement of a first dimension of a resist pattern on a substrate from a previously obtained relation between a dimension of a resist pattern and a temperature of thermal processing, a second dimension of the resist pattern after thermal processing is performed at the corrected processing temperature is measured, a distribution within the substrate of the second dimension is classified into a linear component expressed by an approximated curved surface and a nonlinear component, a processing condition of exposure processing is corrected based on the linear component from a previously obtained relation between a dimension of a resist pattern and a processing condition of exposure processing, and thermal processing at the processing temperature corrected in a temperature correcting step and exposure processing under the processing condition corrected in an exposure condition correcting step are performed to form a predetermined pattern.

REFERENCES:
patent: 7588868 (2009-09-01), Zach et al.
patent: 7897897 (2011-03-01), Jyousaka et al.
patent: 2009/0008381 (2009-01-01), Jyousaka et al.
patent: 2006-222354 (2006-08-01), None
patent: 2006-228816 (2006-08-01), None

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