Photocopying – Projection printing and copying cameras – With temperature or foreign particle control
Reexamination Certificate
2008-02-14
2009-10-27
Mathews, Alan A (Department: 2851)
Photocopying
Projection printing and copying cameras
With temperature or foreign particle control
C355S027000, C355S053000, C355S077000, C356S611000
Reexamination Certificate
active
07609361
ABSTRACT:
A substrate processing method and a substrate processing system exclude wafers W provided with a protective film having surface defects that will cause components of a resist to dissolve in an immersion liquid during an immersion exposure process, and rated abnormal from those to be processed by the immersion exposure process. The substrate processing system is provided with a protective film forming module for forming a protective film on a resist film formed on a surface of a wafer W, an exposure system4for processing the surface of the wafer W coated with a transparent immersion liquid layer by an immersion exposure process, and a developing module28for processing the wafer W by a developing process using a developer. A protective film inspecting device33detects surface defects in a protective film formed on a wafer W. A control computer60decides whether or not surface defects detected by the protective film inspecting device33is normal on the basis of information about the surface defects provided by the protective film inspecting device33, and gives a control signal representing the results of decision to the exposure system4. The control computer60gives an exposure process execution signal requesting processing the wafer W by the exposure process to the exposure system4when the surface defects in the protective film are rated normal or gives an exposure process not executing signal requesting not processing the substrate by the exposure process to the exposure system when the surface defects in the protective film are rated abnormal.
REFERENCES:
patent: 7241061 (2007-07-01), Akimoto et al.
patent: 2007/0177869 (2007-08-01), Yamamoto et al.
patent: 2007/0252960 (2007-11-01), Kida
patent: 3582820 (2004-08-01), None
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patent: 2006-80404 (2006-03-01), None
patent: WO 2006/062188 (2006-06-01), None
English Translation of JP 2006-080404 (dated Mar. 23, 2006).
English Translation of JP 2001-274057 (dated Oct. 5, 2002).
Mathews Alan A
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Tokyo Electron Limited
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