Substrate processing method and substrate processing system

Details Substrate processing method and substrate processing system Substrate processing method and substrate processing system

2003-10-08

2008-11-04

Moore, Karla (Department: 1792)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With measuring, sensing, detection or process control means

C156S345310, C156S345320, C414S935000

Reexamination Certificate

active

07445689

ABSTRACT:
The substrate processing system has an ozone generator that generates and supplies an ozone-containing gas to plural or N (N is a natural number not less than 2) ozone process units. The ozone generator has capacity of supplying the first processing fluid to only N−n of the first processing units simultaneously at respective supply rates each in accordance with a demand for appropriately performing the first process in each of the first processing units, where n is a natural number and N−n is not less than 2. A controller that controls a timing of loading of the substrate into the ozone process units by the conveyer so as to avoid a case where more than N−n of the first processing units are simultaneously carrying out the first treatment each using the first processing fluid, where n is a natural number and N−n is not less than 2.

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