Substrate processing method and substrate processing apparatus

Details Substrate processing method and substrate processing apparatus Substrate processing method and substrate processing apparatus

2011-06-14

2011-06-14

Vinh, Lan (Department: 1713)

Etching a substrate: processes

Nongaseous phase etching of substrate

Using film of etchant between a stationary surface and a...

C216S083000, C216S103000, C134S001200

Reexamination Certificate

active

07959820

ABSTRACT:
According to the substrate processing method of the invention, a jet of droplets generated from a gas and a heated processing liquid is supplied to the surface of a substrate. A resist stripping liquid to strip off the resist from the surface of the substrate is then supplied to the surface of the substrate.

REFERENCES:
patent: 5866307 (1999-02-01), Kiba et al.
patent: 5896875 (1999-04-01), Yoneda
patent: 6217657 (2001-04-01), Kiba et al.
patent: 6274506 (2001-08-01), Christenson et al.
patent: 6615854 (2003-09-01), Hongo et al.
patent: 6815150 (2004-11-01), Nakahara et al.
patent: 6815376 (2004-11-01), Tsai
patent: 2002/0035762 (2002-03-01), Okuda et al.
patent: 2002/0059947 (2002-05-01), Sato et al.
patent: 2004/0007559 (2004-01-01), Hongo et al.
patent: 2004/0074526 (2004-04-01), Aoki et al.
patent: 2004/0089328 (2004-05-01), Sato et al.
patent: 2004/0200513 (2004-10-01), Okuda et al.
patent: 2004/0206378 (2004-10-01), Okuda et al.
patent: 2004/0206379 (2004-10-01), Okuda et al.
patent: 2004/0206452 (2004-10-01), Okuda et al.
patent: 2004/0261817 (2004-12-01), Araki et al.
patent: 2005/0085087 (2005-04-01), Okigawa et al.
patent: 2005/0115671 (2005-06-01), Araki
patent: 2005/0158671 (2005-07-01), Shimizu et al.
patent: 1624871 (2005-06-01), None
patent: 2001-308070 (2001-11-01), None
patent: 2002-208579 (2002-07-01), None
patent: 2003-177556 (2003-06-01), None
patent: 2005-109167 (2005-04-01), None
patent: 10-0423771 (1997-04-01), None
patent: 2000-0077317 (2000-12-01), None
patent: 535216 (2003-06-01), None
patent: 200511431 (2005-03-01), None
Office Action issued on Jan. 16, 2009 in connection with corresponding Chinese Patent Application No. 200610142366.8.
Office Action issued Mar. 25, 2008 in connection with the Korean Patent Application No. 10-2006-0098398.
Taiwan Office Action issued May 18, 2010 in connection with corresponding Taiwanese Patent Application No. 095137709.
Office Action issued Apr. 7, 2011 in connection with corresponding Japanese Patent Application No. 2006-275098.

Affiliated with

Also associated with

Rating

Substrate processing method and substrate processing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate processing method and substrate processing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate processing method and substrate processing apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2627862