Substrate processing method and substrate processing apparatus

Details Substrate processing method and substrate processing apparatus Substrate processing method and substrate processing apparatus

2003-12-16

2009-06-23

McPherson, John A (Department: 1795)

Coating apparatus

With means to centrifuge work

C118S016000, C396S604000, C396S611000

Reexamination Certificate

active

07550043

ABSTRACT:
A processing chamber actually performs a heating process for a substrate. The processing chamber has an upper plate, a lower plate, and an exhaust opening. The upper plate heats a resist from a front surface of the substrate. The lower plate heats the resist from a rear surface of the substrate. The exhaust opening exhausts gas from the processing chamber. The upper plate is disposed in such a manner that it can be raised and lowered in the processing chamber by an upper air cylinder that composes an upper driving mechanism. The lower plate is disposed on a floor of the processing chamber. The exhaust opening is connected to a pump through a pipe. Heating temperature and heating time of the upper plate and the lower plate are controlled by a heating control portion. A pressure in the processing chamber is controlled by a pump. The pump is controlled by a pressure controlling portion.

REFERENCES:
patent: 5626913 (1997-05-01), Tomoeda et al.
patent: 6300043 (2001-10-01), Konishi et al.
patent: 6371667 (2002-04-01), Kitano et al.
patent: 2001/0003964 (2001-06-01), Kitano et al.
patent: 2002/0076658 (2002-06-01), Matsushita et al.
patent: 2002/0123011 (2002-09-01), Kawano et al.
patent: 05-197160 (1993-08-01), None
patent: 06-089856 (1994-03-01), None
patent: 06-188184 (1994-07-01), None
patent: 07-078749 (1995-03-01), None
patent: 09-232217 (1997-09-01), None
patent: 11-097329 (1999-04-01), None
patent: 2000-181048 (2000-06-01), None
patent: 2002-148808 (2002-05-01), None
patent: 2003-045893 (2003-02-01), None
JPO Office Action dated Jul. 10, 2007, App. No. 2003-336552 (2 pages).
JPO Office Action dated Sep. 11, 2007, App. No. 2003-336552 (2 pages).

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