Abrading – Precision device or process - or with condition responsive... – Controlling temperature
Reexamination Certificate
2006-03-21
2006-03-21
Nguyen, George (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
Controlling temperature
C451S053000, C451S168000, C451S303000
Reexamination Certificate
active
07014529
ABSTRACT:
A substrate processing apparatus polishes a to-be-polished portion of a semiconductor substrate with a polishing tape. Part of the polishing tape is heated in advance. Part of the polishing tape is deformed conforming to a shape of the to-be-polished portion. Part of the deformed polishing tape is brought into contact with the to-be-polished portion of the substrate. The substrate and polishing tape are moved relative to each other.
REFERENCES:
patent: 5669804 (1997-09-01), Takahashi et al.
patent: 5733181 (1998-03-01), Hasegawa et al.
patent: 6000997 (1999-12-01), Kao et al.
patent: 6478879 (2002-11-01), Jackson
patent: 6837773 (2005-01-01), Brunelli
patent: 05-329759 (1993-12-01), None
patent: 8-1494 (1996-01-01), None
patent: 08-118226 (1996-05-01), None
patent: 09-076148 (1997-03-01), None
Kubota Takeo
Shigeta Atsushi
Toyota Gen
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Nguyen George
LandOfFree
Substrate processing method and substrate processing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Substrate processing method and substrate processing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate processing method and substrate processing apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3551540