Substrate processing method and substrate processing apparatus

Abrading – Precision device or process - or with condition responsive... – Controlling temperature

Reexamination Certificate

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Details

C451S053000, C451S168000, C451S303000

Reexamination Certificate

active

07014529

ABSTRACT:
A substrate processing apparatus polishes a to-be-polished portion of a semiconductor substrate with a polishing tape. Part of the polishing tape is heated in advance. Part of the polishing tape is deformed conforming to a shape of the to-be-polished portion. Part of the deformed polishing tape is brought into contact with the to-be-polished portion of the substrate. The substrate and polishing tape are moved relative to each other.

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patent: 5733181 (1998-03-01), Hasegawa et al.
patent: 6000997 (1999-12-01), Kao et al.
patent: 6478879 (2002-11-01), Jackson
patent: 6837773 (2005-01-01), Brunelli
patent: 05-329759 (1993-12-01), None
patent: 8-1494 (1996-01-01), None
patent: 08-118226 (1996-05-01), None
patent: 09-076148 (1997-03-01), None

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