Substrate processing method and substrate processing apparatus

Details Substrate processing method and substrate processing apparatus Substrate processing method and substrate processing apparatus

2005-04-05

2005-04-05

Jolley, Kirsten (Department: 1762)

Coating processes

Centrifugal force utilized

C427S350000, C427S369000, C427S374100, C427S377000, C427S385500, C427S425000, C118S052000, C118S058000, C118S320000, C438S778000, C438S780000

Reexamination Certificate

active

06875466

ABSTRACT:
The wafer coated with the resist is deliberately placed in the vapor before being transferred to an aligner that exposes the resist on the wafer, the vapor, for example, the moisture, uniformly adheres onto the resist on the wafer. As a result, the substrate can uniformly be exposed in the following exposing process, and the uniformity of the line width and the like can be improved.

REFERENCES:
patent: 5658615 (1997-08-01), Hasebe et al.
patent: 5667942 (1997-09-01), Nakao et al.
patent: 5670210 (1997-09-01), Mandal et al.
patent: 5944894 (1999-08-01), Kitano et al.
patent: 6002108 (1999-12-01), Yoshioka
patent: 6040120 (2000-03-01), Matsushita et al.
patent: 6254936 (2001-07-01), Gurer et al.
patent: 6261744 (2001-07-01), Yoshioka
patent: 6306778 (2001-10-01), Sakai
patent: 7-161619 (1995-06-01), None
patent: 8-2764006 (1996-10-01), None

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