Substrate processing method and substrate processing apparatus

Details Substrate processing method and substrate processing apparatus Substrate processing method and substrate processing apparatus

2005-01-04

2005-01-04

Rutledge, D. (Department: 2851)

Photography

Fluid-treating apparatus

Fluid application to one side only of photographic medium

C118S052000, C427S240000

Reexamination Certificate

active

06837631

ABSTRACT:
A developing process of the photo-resist coated on the wafer is performed, cleaning the developing solution by a cleaning solution then transferring the wafer to the electron beam radiation unit before the rinsing solution and the resist dries out. The radiation chamber is replaced with a helium gas to form a predetermined degree of vacuum or atmospheric pressure. An electron beam is radiated and the front face of the wafer is heated for a predetermined period of time. In this method, deformation and breaking of a pattern caused by drying after the development can be prevented.

REFERENCES:
patent: 5843627 (1998-12-01), Bok
patent: 6357938 (2002-03-01), Noh
patent: 20010001392 (2001-05-01), Hirae et al.
patent: 03-270132 (1991-12-01), None
patent: 05-315310 (1993-11-01), None
patent: 06-283414 (1994-10-01), None
patent: 2000-07885 (2000-03-01), None

Affiliated with

Also associated with

Rating

Substrate processing method and substrate processing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate processing method and substrate processing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate processing method and substrate processing apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3394578