Substrate processing method and program

Details Substrate processing method and program Substrate processing method and program

2011-03-22

2011-03-22

Meeks, Timothy H (Department: 1712)

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

C427S058000, C427S098600, C427S331000, C427S355000, C427S359000, C427S372200, C427S379000, C427S553000, C427S558000, C427S532000, C427S096100, C427S097100, C427S097600, C451S056000, C451S065000, C451S066000, C451S028000, C451S064000, C451S283000, C451S285000, C451S287000

Reexamination Certificate

active

07910157

ABSTRACT:
In the present invention, an insulating material is applied onto a substrate in a coating treatment unit to form a coating insulating film. The substrate is heated in the heating processing unit, whereby the coating insulating film is hardened partway. A brush is then pressed against the front surface of the coating insulating film in a planarization unit and moved along the front surface of the coating insulating film, thereby planarizing the coating insulating film. The substrate is then heated to completely harden the coating insulating film. According to the present invention, the coating film can be planarized without using the CMP technology.

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