Substrate processing method and apparatus

Details Substrate processing method and apparatus Substrate processing method and apparatus

2011-06-14

2011-06-14

Bareford, Katherine A (Department: 1715)

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

C427S099100, C427S099500, C427S265000, C427S305000, C427S306000

Reexamination Certificate

active

07959977

ABSTRACT:
A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.

REFERENCES:
patent: 4100037 (1978-07-01), Baron et al.
patent: 4585517 (1986-04-01), Stemple
patent: 5584936 (1996-12-01), Pickering et al.
patent: 5922133 (1999-07-01), Tepman et al.
patent: 6344413 (2002-02-01), Zurcher et al.
patent: 6352623 (2002-03-01), Volodarsky et al.
patent: 6436615 (2002-08-01), Brandow et al.
patent: 6451114 (2002-09-01), Stevens
patent: 2002/0063097 (2002-05-01), Fukunaga et al.
patent: 05-218048 (1993-08-01), None
patent: 02/47139 (2002-06-01), None
English language abstract for Japanese Application No. 2001-316881, Nov. 2001.
English language abstract for Japanese Application No. 2002-317300, Oct. 2002.
English language abstract for Japanese Application No. 2001-020096, Jan. 2001.
English language abstract for Japanese Application No. 2002-285343, Oct. 2002.

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