Substrate processing method and apparatus

Details Substrate processing method and apparatus Substrate processing method and apparatus

2003-11-14

2010-06-15

Lamb, Brenda A (Department: 1792)

Coating apparatus

Work holders, or handling devices

Gripper or clamped work type

C118S505000

Reexamination Certificate

active

07735451

ABSTRACT:
A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.

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patent: 02/47139 (2002-06-01), None
English language abstract for Japanese Application No. 2001-316881.
English language abstract for Japanese Application No. 2002-317300.
English language abstract for Japanese Application No. 2001-020096.
English language abstract for Japanese Application No. 2002-285343.

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