Substrate processing method

Details Substrate processing method Substrate processing method

2005-04-12

2005-04-12

Jolley, Kirsten (Department: 1762)

Coating processes

Centrifugal force utilized

C427S425000, C118S052000, C118S320000, C438S780000, C438S782000

Reexamination Certificate

active

06878401

ABSTRACT:
A specific amount of a processing solution is supplied on a wafer by spraying the processing solution from a first end (tip) of a nozzle. The solution surface of the processing solution remaining in the nozzle is sucked back to a second end side of the nozzle by aspirating the remaining processing solution to the second end side. The first end of the nozzle is then soaked into a fluid. The processing solution remaining in the nozzle is aspirated to the second end side to aspirate a specific amount of the fluid into the first end of the nozzle for further sucking back the solution surface of the processing solution to the second end side, thus the solution surface of the processing solution being not touching the fluid.

REFERENCES:
patent: 4416213 (1983-11-01), Sakiya
patent: 5261566 (1993-11-01), Nakayama
patent: 5928425 (1999-07-01), Lee
patent: 6054181 (2000-04-01), Nanbu et al.
patent: 6062442 (2000-05-01), Yang et al.
patent: 6592936 (2003-07-01), Arioka
patent: 20010036424 (2001-11-01), Takahashi et al.
patent: 04-200768 (1992-07-01), None
patent: 11-333359 (1999-12-01), None

Affiliated with

Also associated with

Rating

Substrate processing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate processing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate processing method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3418457