Substrate processing method

Details Substrate processing method Substrate processing method

2005-07-26

2005-07-26

Meeks, Timothy (Department: 1762)

Coating processes

Coating by vapor, gas, or smoke

C427S255600

Reexamination Certificate

active

06921554

ABSTRACT:
Process gas supply/stop operations are intermittently performed. As the hydrophobic process progresses, the temperature of a gas contract portion of a wafer lowers. While the hydrophobic process stops, the temperature of the gas contact portion of the wafer rises to the original temperature. Thereafter, the hydrophobic process resumes. Thus, while the temperature of the gas contact portion of wafer is suppressed from largely lowering, the hydrophobic process can be performed. Thus, non-uniformity of the hydrophobic process on the front surface of the wafer is reduced.

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