Substrate processing method

Details Substrate processing method Substrate processing method

2004-06-24

2008-08-05

Baumeister, Bradley W. (Department: 2891)

Semiconductor device manufacturing: process

With measuring or testing

Optical characteristic sensed

C438S007000, C257SE21530, C356S630000

Reexamination Certificate

active

07407821

ABSTRACT:
There is provided a substrate processing method and apparatus which can measure and monitor thickness and/or properties of a film formed on a substrate as needed, and quickly correct a deviation in process conditions, and which can therefore stably provide a product of constant quality. A substrate processing method for processing a substrate having a metal and an insulating material exposed on its surface in such a manner that a film thickness of the metal, with an exposed surface of the metal as a reference plane, is selectively or preferentially changed, including measuring a change in the film thickness and/or a film property of the metal during and/or immediately after processing, and monitoring processing and adjusting processing conditions based on results of this measurement.

REFERENCES:
patent: 4141780 (1979-02-01), Kleinknecht et al.
patent: 4618262 (1986-10-01), Maydan et al.
patent: 5399229 (1995-03-01), Stefani et al.
patent: 5494697 (1996-02-01), Blayo et al.
patent: 5559428 (1996-09-01), Li et al.
patent: 5644221 (1997-07-01), Li et al.
patent: 5659492 (1997-08-01), Li et al.
patent: 5660672 (1997-08-01), Li et al.
patent: 5663637 (1997-09-01), Li et al.
patent: 5674787 (1997-10-01), Zhao et al.
patent: 5695810 (1997-12-01), Dubin et al.
patent: 5770948 (1998-06-01), Li et al.
patent: 6052191 (2000-04-01), Brayden et al.
patent: 6225223 (2001-05-01), Liu et al.
patent: 6233046 (2001-05-01), Alba et al.
patent: 6376267 (2002-04-01), Noack et al.
patent: 6429943 (2002-08-01), Opsal et al.
patent: 6479384 (2002-11-01), Komai et al.
patent: 6503834 (2003-01-01), Chen et al.
patent: 6568290 (2003-05-01), Poris
patent: 6573606 (2003-06-01), Sambucetti et al.
patent: 6723626 (2004-04-01), Tsuchiya et al.
patent: 2001/0016363 (2001-08-01), Yano et al.
patent: 2001/0036676 (2001-11-01), Mitsuhashi et al.
patent: 2002/0102749 (2002-08-01), Fielden et al.
patent: 2002/0107660 (2002-08-01), Nikoonahad et al.
patent: 2003/0113996 (2003-06-01), Nogami et al.
patent: 2003/0116439 (2003-06-01), Seo et al.
patent: 2003/0124263 (2003-07-01), Ueno et al.
patent: 2003/0129774 (2003-07-01), Christian et al.

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