Cleaning and liquid contact with solids – Processes – Including use of vacuum – suction – or inert atmosphere
Reexamination Certificate
2004-07-28
2009-08-25
Stinson, Frankie L (Department: 1792)
Cleaning and liquid contact with solids
Processes
Including use of vacuum, suction, or inert atmosphere
C134S001200, C134S001300
Reexamination Certificate
active
07578886
ABSTRACT:
A substrate processing apparatus and a substrate processing method is provided for performing a chemical liquid process, a cleaning process, a drying process, or the like while rotating a substrate such as a semiconductor wafer or a liquid crystal substrate. A substrate holding apparatus is provided for holding and rotating a substrate. The substrate processing apparatus for processing a substrate while supplying a fluid to the substrate includes a substrate holder for holding and rotating the substrate, and a holder suction unit for sucking the fluid from the substrate holder. The substrate holding apparatus includes a plurality of rollers which are brought into contact with an edge portion of a substrate so as to hold and rotate the substrate, and at least one moving mechanism for moving the rollers.
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Machine Translation of Japanese Publication No. JP 09-270412 A.
Mitsuhiko Shirakashi et al., “A Processing Liquid Coating Apparatus and a Processing Liquid Coating Method”, U.S. Appl. No. 10/573,915, filed Mar. 30, 2006, which is the national stage of PCT/JP2004/016284, filed Oct. 27, 2004. (Image File Wrapper available).
Inoue Yuki
Ito Kenya
Kamezawa Masayuki
Katakabe Ichiro
Saito Takayuki
Ebara Corporation
Stinson Frankie L
Waldbaum Samuel A
Wenderoth , Lind & Ponack, L.L.P.
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