Substrate-processing apparatus, substrate-processing method,...

Details Substrate-processing apparatus, substrate-processing method,... Substrate-processing apparatus, substrate-processing method,...

2011-01-11

2011-01-11

Young, Christopher G (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Including control feature responsive to a test or measurement

C430S313000, C430S330000, C355S027000, C355S030000, C396S611000

Reexamination Certificate

active

07867674

ABSTRACT:
A pattern forming system1includes a checking apparatus400and a control section500. The checking apparatus400is configured to measure and check a sidewall angle SWA of a resist pattern formed on a substrate W after a developing process. The control section500is configured to use a difference between a target value of the sidewall angle SWA of the resist pattern after the developing process and a check result of the sidewall angle SWA obtained by the checking apparatus400, to set a process condition for a first heat process71to74or a second heat process84to89so as to cause the sidewall angle SWA to approximate the target value thereof after the developing process.

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