Coating apparatus – Gas or vapor deposition – Work support
Reexamination Certificate
2004-11-29
2008-11-25
Cleveland, Michael (Department: 1792)
Coating apparatus
Gas or vapor deposition
Work support
Reexamination Certificate
active
07455734
ABSTRACT:
A nonuniform portion of a film thickness on a substrate owing to effects of a support column, a substrate mounting portion, and the like which constitute a substrate holder is eliminated, and uniformity of the film thickness of the substrate is enhanced.A substrate processing apparatus houses plural wafers (substrates) held on a boat (substrate holder) in a processing chamber, supplying processing gas to the heated processing chamber, thereby performing film-forming processing for the wafers. The boat includes: at least three support columns15provided substantially vertically; plural wafer support portions16(substrate mounting portions) which are provided at multi-stages on the support columns and mount the plural wafers substantially horizontally at a predetermined interval; and plural ring-like plates13arranged on the support columns15, and provided substantially horizontally at a predetermined interval with respect to the wafers supported on the wafer support portions16.
REFERENCES:
patent: 4745088 (1988-05-01), Inoue et al.
patent: 5169684 (1992-12-01), Takagi
patent: 5316472 (1994-05-01), Niino et al.
patent: 5651670 (1997-07-01), Okase et al.
patent: 5743967 (1998-04-01), Kobori et al.
patent: 5820683 (1998-10-01), Ishii et al.
patent: 6287112 (2001-09-01), Van Voorst Vader et al.
patent: 2002/0070095 (2002-06-01), Osaka et al.
patent: 2003/0077150 (2003-04-01), Matsuda et al.
patent: 2004/0099219 (2004-05-01), Park et al.
patent: A 4-2118 (1992-01-01), None
patent: A 9-92623 (1997-04-01), None
patent: A 10-41236 (1998-02-01), None
patent: A 10-233368 (1998-09-01), None
patent: A 11-40509 (1999-02-01), None
patent: A 2001-168175 (2001-06-01), None
English translation of JP 04-002118, Inventor Niino Rejii, Jul. 01, 1992.
Morimitsu Kazuhiro
Yamaguchi Takatomo
Chen Keath
Cleveland Michael
Hitachi Kokusai Electric Inc.
Oliff & Berridg,e PLC
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