Substrate processing apparatus inspection method and method...

Details Substrate processing apparatus inspection method and method... Substrate processing apparatus inspection method and method...

2011-01-18

2011-01-18

Cleveland, Michael (Department: 1712)

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

C134S026000, C438S014000, C438S689000, C438S706000, C438S734000

Reexamination Certificate

active

07871471

ABSTRACT:
It is intended to prevent an increase in the quantity of particles on a test-piece substrate having undergone processing executed at a low temperature equal to or lower than 0° C. In an inspection method adopted when inspecting the state inside a processing chamber by measuring the quantity of particles on a test-piece substrate, i.e., a test-piece wafer, the test-piece wafer W having undergone a specific type of test processing inside the processing chamber is carried out into a transfer chamber via a loadlock chamber after holding it in the loadlock chamber over a predetermined length of time while delivering a dried inert gas into the loadlock chamber. The predetermined length of time is set to a value at which the increase in the quantity of particles on the test-piece wafer can be kept down at least within an acceptable range.

REFERENCES:
patent: 2003/0022512 (2003-01-01), Saito et al.
patent: 2003/0207579 (2003-11-01), Rattner et al.
patent: 2004/0222383 (2004-11-01), Kawakami
patent: 2005/0045276 (2005-03-01), Patel et al.
patent: 2005/0090927 (2005-04-01), Tanaka et al.
patent: 2006-179528 (2006-07-01), None

Affiliated with

Also associated with

Rating

Substrate processing apparatus inspection method and method... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate processing apparatus inspection method and method..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate processing apparatus inspection method and method... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2677506