Substrate processing apparatus for drying substrate

Details Substrate processing apparatus for drying substrate Substrate processing apparatus for drying substrate

2008-09-02

2008-09-02

Barr, Michael (Department: 1792)

Cleaning and liquid contact with solids

Apparatus

With heating, cooling or heat exchange means

C134S902000, C134S200000, C134S001200

Reexamination Certificate

active

10740711

ABSTRACT:
A substrate processing apparatus includes a container in which a heating plate, a discharge nozzle for discharging a vapor of organic solvent, and a discharge nozzle for supplying a process gas and a cooling gas are provided. A pump in communication with an exhaust outlet of the container exhausts an atmosphere from the container to reduce pressure in the container. Therefore, the substrate processing apparatus is capable of performing (1) the process of drying a substrate in a reduced-pressure atmosphere by the use of the vapor of organic solvent, and (2) the process of drying the substrate in the reduced-pressure atmosphere by heating, to thereby efficiently dry the substrate.

REFERENCES:
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patent: 2003/0066797 (2003-04-01), Sasaki
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patent: 05-243205 (1993-09-01), None
patent: 07-283126 (1995-10-01), None
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English translation of Abstract for Japanese application laid-open No. 08-064514.
English translation of Abstract for Japanese application laid-open No. 05-243205.
English translation of Abstract for Japanese application laid-open No. 2001-023946.
English translation of Abstract for Japanese application laid-open No. 07-283126.
English translation of Japanese Office Action dated Aug. 1, 2006 issued in connection with corresponding Japanese application No. 2002-374740.

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