Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With measuring – sensing – detection or process control means
Reexamination Certificate
2004-11-10
2008-11-25
Lindsay, Jr., Walter L. (Department: 2812)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With measuring, sensing, detection or process control means
C156S345310, C156S345320, C118S696000, C118S712000, C118S719000, C438S014000, C700S121000
Reexamination Certificate
active
07455747
ABSTRACT:
A substrate processing apparatus, according to which inspection of various devices in the substrate processing apparatus can be carried out with improved reliability, while reducing the burden on a user. A processing chamber processes semiconductor wafers therein. A transfer chamber transfers the semiconductor wafers. A FOUP (front opening unified pod) houses a plurality of dummy wafers for inspection of the processing chamber or the transfer chamber. A CPU causes an HDD (hard disk drive) to store a housing state relating to the arrangement of the dummy wafers in the FOUP before replacement of dummy wafers in the FOUP and that after the replacement as dummy wafer setup information.
REFERENCES:
patent: 5934856 (1999-08-01), Asakawa et al.
patent: 2003/0182012 (2003-09-01), Yamauchi et al.
patent: 2004/0105737 (2004-06-01), Ozawa et al.
patent: 8-46013 (1996-02-01), None
patent: 2000-150618 (2000-05-01), None
patent: 2001-53131 (2001-02-01), None
Numakura Masahiro
Shimizu Noriaki
Lindsay Jr. Walter L.
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Pompey Ron E
Tokyo Electron Limited
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