Substrate processing apparatus and substrate transferring...

Details Substrate processing apparatus and substrate transferring... Substrate processing apparatus and substrate transferring...

2007-11-20

2007-11-20

Masinick, Michael D. (Department: 2125)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C700S113000, C700S121000, C700S123000, C118S712000, C118S715000, C118S725000, C118S500000, C118S728000, C118S729000, C204S298250, C438S680000

Reexamination Certificate

active

10858049

ABSTRACT:
Shock waves occurring when opening a gate valve between two vacuum chambers and peeling of particles by a viscous force taking place when a gas is supplied into a vacuum chamber are necessary to be suppressed by the apparatus and method of the invention, whereby contamination of a substrate by particles is suppressed. If one vacuum chamber is a substrate processing chamber for performing a vacuum process on the substrate and the other chamber is a transfer chamber having a substrate transfer device therein, the gate valve is opened when inner pressures of both the vacuum chambers are less than 66.5 Pa and higher one thereof is less than twice a lower one thereof. Preferably, a purge gas for peeling of particles is supplied, before supplying the purge gas for pressure control, into the substrate processing chamber with a flow rate greater than that of the purge gas for pressure control.

REFERENCES:
patent: 4657621 (1987-04-01), Johnson et al.
patent: 5943230 (1999-08-01), Rinnen et al.
patent: 6132553 (2000-10-01), Ikeda et al.
patent: 6328864 (2001-12-01), Ishizawa et al.
patent: 6773762 (2004-08-01), Fukiage
patent: 7047903 (2006-05-01), Ito
patent: 2001/0010204 (2001-08-01), Takeyama et al.

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