Substrate processing apparatus and substrate processing method

Details Substrate processing apparatus and substrate processing method Substrate processing apparatus and substrate processing method

2011-05-24

2011-05-24

Van, Luan V (Department: 1724)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S232000

Reexamination Certificate

active

07947156

ABSTRACT:
A substrate processing apparatus can carry out removal of a passive layer (ruthenium oxide) present on a surface of a ruthenium film and electroplating successively, and can reduce the terminal effect at the time of the removal of the passive layer (ruthenium oxide) from the ruthenium film. The substrate processing apparatus includes: an electrolytic processing apparatus for electrochemically removing a passive layer, formed on a surface of a ruthenium film on a substrate, by electrolytic processing with the ruthenium film as a cathode; a copper electroplating apparatus for carrying out copper electroplating on the surface of the ruthenium film on the substrate; and an apparatus frame housing the electrolytic processing apparatus and the copper electroplating apparatus.

REFERENCES:
patent: 6033540 (2000-03-01), Kosaki et al.
patent: 6632335 (2003-10-01), Matsuda et al.
patent: 6746589 (2004-06-01), Mishima et al.
patent: 7135404 (2006-11-01), Baskaran et al.
patent: 2001/0035355 (2001-11-01), Kamijima
patent: 2004/0069647 (2004-04-01), Mizohata et al.
patent: 2004/0069648 (2004-04-01), Andricacos et al.
patent: 2005/0274622 (2005-12-01), Sun et al.
Moffat et al., “Electrodeposition of Cu on Ru Barrier Layers for Damascene Processing”,Journal of The Electrochemical Society, vol. 153, No. 1, pp. C37-C50, 2006.

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