Substrate processing apparatus and substrate processing method

Details Substrate processing apparatus and substrate processing method Substrate processing apparatus and substrate processing method

2010-03-08

2011-10-11

Kornakov, Michael (Department: 1714)

Cleaning and liquid contact with solids

Processes

Using sequentially applied treating agents

C134S032000, C430S311000, C438S906000, C438S908000

Reexamination Certificate

active

08034190

ABSTRACT:
A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, and an interface block. An exposure device is arranged adjacent to the interface block. The interface block comprises washing processing units and an interface transport mechanism. Before a substrate is subjected to exposure processing by the exposure device, the substrate is transported to a washing processing unit by the interface transport mechanism. The substrate is washed and dried by the washing processing unit.

REFERENCES:
patent: 6454472 (2002-09-01), Kim et al.
patent: 6558053 (2003-05-01), Shigemori et al.
patent: 6873938 (2005-03-01), Paxton et al.
patent: 6893171 (2005-05-01), Fukutomi et al.
patent: 7364626 (2008-04-01), Hirose et al.
patent: 7497633 (2009-03-01), Kaneyama et al.
patent: 7658560 (2010-02-01), Kaneyama
patent: 7665916 (2010-02-01), Yamamoto et al.
patent: 2002/0029788 (2002-03-01), Verhaverbeke et al.
patent: 2002/0098458 (2002-07-01), Hashimoto
patent: 2002/0160625 (2002-10-01), Inoue et al.
patent: 2003/0045131 (2003-03-01), Verbeke et al.
patent: 2003/0213431 (2003-11-01), Fukutomi et al.
patent: 2003/0226577 (2003-12-01), Orll et al.
patent: 2004/0005149 (2004-01-01), Sugimoto et al.
patent: 2004/0118814 (2004-06-01), Kim et al.
patent: 2004/0182318 (2004-09-01), Hashinoki et al.
patent: 2005/0069819 (2005-03-01), Shiobara
patent: 2005/0075819 (2005-04-01), Paxton et al.
patent: 2005/0221234 (2005-10-01), Ito
patent: 2005/0287821 (2005-12-01), Higashi et al.
patent: 2006/0017903 (2006-01-01), Bleeker et al.
patent: 2006/0061747 (2006-03-01), Ishii
patent: 2006/0098979 (2006-05-01), Kaneyama et al.
patent: 2006/0104635 (2006-05-01), Kaneyama et al.
patent: 2006/0152698 (2006-07-01), Ishii
patent: 2008/0020315 (2008-01-01), Higashi et al.
patent: 1385882 (2002-12-01), None
patent: 1926662 (2007-03-01), None
patent: 06-151293 (1994-05-01), None
patent: 08-314156 (1996-11-01), None
patent: 10-041261 (1998-02-01), None
patent: 11-233480 (1999-08-01), None
patent: 2002-217267 (2002-08-01), None
patent: 2002-273360 (2002-09-01), None
patent: 3337677 (2002-10-01), None
patent: 2003-092283 (2003-03-01), None
patent: 2003-324139 (2003-11-01), None
patent: 2004-015023 (2004-01-01), None
patent: 2004-087795 (2004-03-01), None
patent: 2004-193597 (2004-07-01), None
patent: 2004-319767 (2004-11-01), None
patent: 2005-109146 (2005-04-01), None
patent: 2005-197469 (2005-07-01), None
patent: 2005-294520 (2005-10-01), None
patent: 2006-024684 (2006-01-01), None
patent: WO 99/49504 (1999-09-01), None
patent: WO 2004/053956 (2004-06-01), None
patent: WO 2004/053959 (2004-06-01), None
patent: WO 2004053959 (2004-06-01), None
patent: WO 2004/102646 (2004-11-01), None
Office Action of Chinese Application No. 200510120446.9, mailed dated Jul. 24, 2009, 6 pages.
Office Action of Chinese Application No. 200510120446.9, mailed dated Apr. 2, 2010, 7 pages.
U.S. Appl. No. 12/754,872, filed Apr. 6, 2010; first named inventor: Koji Kaneyama.
Office Action of Chinese Application No. 200510120446.9, mailed Aug. 12, 2010, 9 pages total. [No English Translation].
Office Action in the counterpart Japanese Application No. 2005-267332, dated Mar. 1, 2011. 3 pages.
Office Action in the counterpart Japanese Application No. 2005-267332 dated May 31, 2011, 3 pages.

Affiliated with

Also associated with

Rating

Substrate processing apparatus and substrate processing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate processing apparatus and substrate processing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate processing apparatus and substrate processing method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4272860