Substrate processing apparatus and substrate processing method

Coating apparatus – Interfacing control of plural operations

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C118S696000, C118S686000, C118S702000, C118S052000, C118S066000, C396S611000

Reexamination Certificate

active

07819080

ABSTRACT:
A substrate transfer system to reduce total processing time by transferring a substrate at a first delivery stage to a process block where processing can be carried out earliest. The substrate processing apparatus includes a first transfer device delivering a wafer with respect to a substrate carrier, and a second transfer device delivering a wafer between a plurality of process blocks and the first transfer device via a first delivery stage, to transfer the wafer with respect to the process blocks. The process block where there is no wafer or where processing of the last wafer within the relevant process block will be completed earliest is determined based on processing information of the wafers from the process blocks, and the wafer of the first delivery stage is transferred by the second transfer device to the relevant process block. This ensures smooth transfer of the wafer to the process block.

REFERENCES:
patent: 6168667 (2001-01-01), Yoshioka
patent: 6377329 (2002-04-01), Takekuma
patent: 6851872 (2005-02-01), Okubo et al.
patent: 7322756 (2008-01-01), Akimoto et al.
patent: 5-343497 (1993-12-01), None
patent: 08-162514 (1996-06-01), None
patent: 10-144765 (1998-05-01), None
patent: 11-163079 (1999-06-01), None
patent: 2000-124124 (2000-04-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Substrate processing apparatus and substrate processing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate processing apparatus and substrate processing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate processing apparatus and substrate processing method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4218674

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.