Coating apparatus – Immersion or work-confined pool type – With work supports or guides
Reexamination Certificate
2006-06-20
2009-08-18
Edwards, Laura (Department: 1792)
Coating apparatus
Immersion or work-confined pool type
With work supports or guides
C118S429000, C118S500000, C204S270000, C204S278000, C204S297010
Reexamination Certificate
active
07575636
ABSTRACT:
The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.
REFERENCES:
patent: 3489608 (1970-01-01), Jacobs et al.
patent: 3916937 (1975-11-01), Nystrom
patent: 4174261 (1979-11-01), Pellegrino
patent: 4254590 (1981-03-01), Eisele et al.
patent: 5377708 (1995-01-01), Bergman et al.
patent: 5573023 (1996-11-01), Thompson et al.
patent: 5795215 (1998-08-01), Guthrie et al.
patent: 6074544 (2000-06-01), Reid et al.
patent: 6077412 (2000-06-01), Ting et al.
patent: 6258220 (2001-07-01), Dordi et al.
patent: 6294059 (2001-09-01), Hongo et al.
patent: 6352623 (2002-03-01), Volodarsky et al.
patent: 6390904 (2002-05-01), Gleason et al.
patent: 6964792 (2005-11-01), Mayer et al.
patent: 2001/0017105 (2001-08-01), Ishida et al.
patent: 2002/0127956 (2002-09-01), Ashjaee et al.
patent: 2004/0040131 (2004-03-01), Miyazaki et al.
patent: 11-350148 (1999-12-01), None
patent: 2003/105200 (2003-12-01), None
Dai Naoki
Katsuoka Seiji
Kobayashi Ken-ichi
Miyazaki Mitsuru
Motoshima Yasuyuki
Ebara Corporation
Edwards Laura
Wenderoth , Lind & Ponack, L.L.P.
LandOfFree
Substrate processing apparatus and substrate processing method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Substrate processing apparatus and substrate processing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate processing apparatus and substrate processing method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4115852