Substrate processing apparatus and substrate processing method

Details Substrate processing apparatus and substrate processing method Substrate processing apparatus and substrate processing method

2002-08-28

2008-08-26

Schillinger, Laura M. (Department: 2813)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

C156S345540

Reexamination Certificate

active

07416632

ABSTRACT:
A substrate processing apparatus and a substrate processing method are provided wherein an oxide film which is thinner than the conventional films can be formed with uniform thickness when forming an oxide film on the front-side surface of a substrate.A substrate processing apparatus (12) for processing a substrate (W) by feeding a processing liquid comprises: a temperature regulator (133) to regulate the temperature of said processing liquid; and a underplate temperature adjuster (115) to adjust the temperature of an underplate (77) which is placed in proximity to the backside surface of said substrate W.

REFERENCES:
patent: 6096233 (2000-08-01), Taniyama et al.
patent: 6197150 (2001-03-01), Kwag et al.
patent: 6467297 (2002-10-01), Bollinger et al.
patent: 7225819 (2007-06-01), Jackson
patent: 2004/0253833 (2004-12-01), Takehiko et al.
patent: 2005/0160990 (2005-07-01), Lubomirsky et al.
patent: 2005/0263066 (2005-12-01), Lubomirsky et al.
patent: 2006/0160368 (2006-07-01), Orii et al.
patent: 06-163393 (1994-06-01), None
patent: 07-074140 (1995-03-01), None
patent: 1996/130202 (1996-05-01), None
patent: 10-154701 (1998-06-01), None
patent: 11-307485 (1999-11-01), None
patent: 2000-195839 (2000-07-01), None
patent: 2001-085383 (2001-03-01), None
International Preliminary Examination Report (PCT/IPEA/409) (translated) issued for PCT/JP2002/008685.
Notification of Transmittal of Copies of Translation of the International Preliminary Examination Report (PCT/IB/338) issued for PCT/JP2002/008685.

Affiliated with

Also associated with

Rating

Substrate processing apparatus and substrate processing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate processing apparatus and substrate processing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate processing apparatus and substrate processing method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4019703