Substrate processing apparatus and substrate processing method

Details Substrate processing apparatus and substrate processing method Substrate processing apparatus and substrate processing method

2007-06-12

2007-06-12

Moore, Karla (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With measuring, sensing, detection or process control means

C156S074000, C156S914000, C134S094100

Reexamination Certificate

active

10431364

ABSTRACT:
A substrate processing apparatus removes resist films formed on wafers by holding the wafers in a processing vessel and exposing the wafers to a mixed gaseous fluid of steam and an ozone-containing gas into the processing vessel. The inner surfaces, to be exposed to the mixed gaseous fluid, of the processing vessel and the surfaces, to be exposed to the mixed gaseous fluid, of component members placed in the processing vessel are coated with SiO2film to protect the same from the corrosive action of the mixed gaseous fluid.

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Taiwan Office Action issued on Mar. 3, 2005, and English translation.

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