Coating processes – Centrifugal force utilized
Reexamination Certificate
2006-03-14
2006-03-14
Jolley, Kirsten (Department: 1762)
Coating processes
Centrifugal force utilized
C427S299000, C427S425000, C118S052000, C118S066000, C118S069000, C118S320000, C438S758000, C438S780000, C396S611000, C430S313000, C430S434000
Reexamination Certificate
active
07011863
ABSTRACT:
A substrate which has been subjected to heat processing in any of hot plate units is transferred to a normal cooling unit by a transfer device and subjected to cooling processing to some extent, and then transferred to a high accuracy cooling unit and subjected to cooling processing with high accuracy, and thereafter transferred to any of coating units or a developing units. Thereby, the substrate can be subjected to the cooling processing with high accuracy and thereafter to coating processing with no increase in apparatus cost and with no decrease in throughput.
REFERENCES:
patent: 5143552 (1992-09-01), Moriyama
patent: 5580607 (1996-12-01), Takekuma et al.
patent: 5664254 (1997-09-01), Ohkura et al.
patent: 5972110 (1999-10-01), Akimoto
patent: 5974682 (1999-11-01), Akimoto
patent: 6215545 (2001-04-01), Matsuyama
patent: 6341903 (2002-01-01), Ueda
patent: 62-132319 (1987-06-01), None
patent: 10-74818 (1998-03-01), None
patent: 11-329927 (1999-11-01), None
Jolley Kirsten
Tokyo Electron Limited
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