Substrate processing apparatus and substrate processing method

Details Substrate processing apparatus and substrate processing method Substrate processing apparatus and substrate processing method

2005-07-26

2005-07-26

Fiorilla, Chris (Department: 1734)

Coating apparatus

Control means responsive to a randomly occurring sensed...

Temperature responsive

C118S689000, C118S725000, C118S058000, C118S059000, C118S062000, C118S063000

Reexamination Certificate

active

06921436

ABSTRACT:
An aging unit (DAC) for processing a wafer W having a coated film formed thereon includes a disposing plate, a temperature control circulating device for controlling the temperature of the disposing plate, a chamber, a gas supply mechanism for supplying an ammonia gas containing a water vapor into the chamber, an input section for inputting the processing time of the wafer W, and a control device for controlling the temperature of the disposing plate, the supply rate of the ammonia gas, and the amount of the water vapor contained in the ammonia gas so as to permit the processing of the wafer W to be finished in the processing time inputted into the input section.

REFERENCES:
patent: 5919520 (1999-07-01), Tateyama et al.
patent: 6174371 (2001-01-01), Iseki et al.
patent: 6248168 (2001-06-01), Takeshita et al.
patent: 6261744 (2001-07-01), Yoshioka
patent: 6306778 (2001-10-01), Sakai
patent: 6453992 (2002-09-01), Kim

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