Substrate processing apparatus and substrate processing method

Details Substrate processing apparatus and substrate processing method Substrate processing apparatus and substrate processing method

2011-03-01

2011-03-01

Markoff, Alexander (Department: 1711)

Cleaning and liquid contact with solids

Processes

Using sequentially applied treating agents

C134S026000, C134S031000, C134S034000, C134S035000, C134S037000, C134S902000

Reexamination Certificate

active

07896973

ABSTRACT:
This substrate processing apparatus supplies wafers W accommodated in a closed processing container10with ozone gas and steam for processing the wafers W. The apparatus includes an ozone-gas generator40for supplying the ozone gas into the processing container10, a steam generator30for supplying the steam into the processing container10and a steam nozzle35arranged in the processing container10and connected to the steam generator30. The steam nozzle35is equipped with a nozzle body35ahaving a plurality of steam ejecting orifices35fformed at appropriate intervals and a heater35hfor preventing dewdrops of the steam from being produced in the nozzle body35a. Consequently, it is possible to prevent the formation of dewdrops of solvent steam, which may produce origins of particles in the closed processing container, unevenness in cleaning (etching), etc., and also possible to improve the processing efficiency.

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