Substrate processing apparatus and substrate processing method

Details Substrate processing apparatus and substrate processing method Substrate processing apparatus and substrate processing method

1999-08-19

2000-08-01

Paik, Sam

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

118724, H05B 368, C23C 1600

Patent

active

060970057

ABSTRACT:
An apparatus includes a mounting table which is a main temperature controlling plate (a main cooling plate), a cooling section for maintaining the mounting table, for example, at 23.degree. C., a holding pin for holding a wafer while lifting it slightly off the mounting table, a mechanism for raising and lowering the pin, an auxiliary cooling plate as an auxiliary temperature controlling plate for cooling the wafer from the opposite side to the mounting table, and raising and lowering means for raising and lowering the auxiliary cooling plate to thereby move it close to and away from the wafer. The auxiliary cooling plate is maintained at a lower temperature than the main cooling plate. The wafer starts to be cooled by the main cooling plate and the auxiliary cooling plate, the auxiliary cooling plate is then moved away from the wafer at a temperature slightly higher than 23.degree. C., for example, at 30.degree. C., and thereafter the wafer is cooled only by the main cooling plate. Thus, the cooling of the wafer can be performed with high efficiency.

REFERENCES:
patent: 4771730 (1988-09-01), Tezuka
patent: 5151871 (1992-09-01), Matsumura et al.
patent: 5581874 (1996-12-01), Aoki et al.
patent: 5817156 (1998-10-01), Tateyama et al.
patent: 5835334 (1998-11-01), McMillin et al.
patent: 5974682 (1999-11-01), Akimoto

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