Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With means for passing discrete workpiece through plural...
Reexamination Certificate
2005-01-25
2005-01-25
Hassanzadeh, Parviz (Department: 1763)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With means for passing discrete workpiece through plural...
C156S345540, C118S719000, C118S729000, C204S298250, C204S298350, C414S935000, C414S939000
Reexamination Certificate
active
06846380
ABSTRACT:
An apparatus and method for processing a microelectronic substrate comprises a main chamber and a movable boundary. The main chamber comprises a main chamber wall enclosing a main chamber interior. The movable boundary is disposed within the main chamber interior, and is movable between a first position and a second position. At the first position, the movable boundary at least partially defines a sub-chamber in which a substrate can be processed. The sub-chamber is fluidly isolated from the main chamber interior, and provides an environment suitable for a high-pressure processing of the substrate such as cleaning or surface preparation. The sub-chamber can be maintained at a high pressure while the main chamber is maintained at either a low pressure, an atmospheric pressure, or at a vacuum. The apparatus can be directly coupled to an external substrate handling and/or fabrication module, such that the main chamber interior provides a buffer between the sub-chamber and the external module. At the second position of the movable boundary, the substrate can be loaded into or removed from the apparatus, such as by transfer to or from any external module provided.
REFERENCES:
patent: 4439261 (1984-03-01), Pavone et al.
patent: 4895107 (1990-01-01), Yano et al.
patent: 4908095 (1990-03-01), Kagatsume et al.
patent: 4944837 (1990-07-01), Nishikawa et al.
patent: 5158704 (1992-10-01), Fulton et al.
patent: 5266205 (1993-11-01), Fulton et al.
patent: 5306350 (1994-04-01), Hoy et al.
patent: 5377705 (1995-01-01), Smith, Jr. et al.
patent: 5482564 (1996-01-01), Douglas et al.
patent: 5494526 (1996-02-01), Paranjpe
patent: 5496901 (1996-03-01), DeSimone
patent: 5514220 (1996-05-01), Wetmore et al.
patent: 5520743 (1996-05-01), Takahashi
patent: 5522938 (1996-06-01), O'Brien
patent: 5589105 (1996-12-01), DeSimone et al.
patent: 5639836 (1997-06-01), DeSimone et al.
patent: 5665527 (1997-09-01), Allen et al.
patent: 5679737 (1997-10-01), DeSimone et al.
patent: 5688879 (1997-11-01), DeSimone
patent: 5700379 (1997-12-01), Biebl
patent: 5739223 (1998-04-01), DeSimone
patent: 5769952 (1998-06-01), Komino
patent: 5780553 (1998-07-01), DeSimone et al.
patent: 5783082 (1998-07-01), DeSimone et al.
patent: 5860467 (1999-01-01), DeSimone et al.
patent: 5866005 (1999-02-01), DeSimone et al.
patent: 5868856 (1999-02-01), Douglas et al.
patent: 5868862 (1999-02-01), Douglas et al.
patent: 5908510 (1999-06-01), McCullough et al.
patent: 5922833 (1999-07-01), DeSimone
patent: 5944996 (1999-08-01), DeSimone et al.
patent: 5976264 (1999-11-01), McCullough et al.
patent: 6001418 (1999-12-01), DeSimone et al.
patent: 6024801 (2000-02-01), Wallace et al.
patent: 6030663 (2000-02-01), McClain et al.
patent: 6067728 (2000-05-01), Farmer et al.
patent: 6083565 (2000-07-01), Carbonell et al.
patent: 6085762 (2000-07-01), Barton
patent: 6113708 (2000-09-01), Hopple et al.
patent: 6149828 (2000-11-01), Vaartstra
patent: 6165559 (2000-12-01), McClain et al.
patent: 6165560 (2000-12-01), McClain et al.
patent: 6176895 (2001-01-01), DeSimone et al.
patent: 6187383 (2001-02-01), McClain et al.
patent: 6200637 (2001-03-01), McClain et al.
patent: 6208751 (2001-03-01), Almogy
patent: 6224312 (2001-05-01), Sundar
patent: 6224774 (2001-05-01), DeSimone et al.
patent: 6228563 (2001-05-01), Starov et al.
patent: 6240936 (2001-06-01), DeSimone et al.
patent: 6242165 (2001-06-01), Vaartstra
patent: 6270844 (2001-08-01), McClain et al.
patent: 6277753 (2001-08-01), Mullee et al.
patent: 6287640 (2001-09-01), McClain et al.
patent: 6296711 (2001-10-01), Loan et al.
patent: 6298902 (2001-10-01), DeSimone et al.
patent: 6306564 (2001-10-01), Mullee
patent: 6343609 (2002-02-01), Kim
patent: 6344243 (2002-02-01), McClain et al.
patent: 6368880 (2002-04-01), Singhvi et al.
patent: 6409837 (2002-06-01), Hillman
patent: 6435798 (2002-08-01), Satoh
patent: 6521046 (2003-02-01), Tanaka et al.
patent: 20020020946 (2002-02-01), Hiraoka et al.
patent: 726099 (1996-08-01), None
patent: 750334 (1996-12-01), None
patent: 1106946 (2001-06-01), None
patent: WO0133613 (2001-05-01), None
patent: WO0160534 (2001-08-01), None
patent: WO0178911 (2001-10-01), None
patent: WO0182368 (2001-11-01), None
patent: WO0187505 (2001-11-01), None
patent: WO0215251 (2002-02-01), None
Brooks Automation Cluster Tool Integration Platforms (company brochure).
Green Tweed MSE Seals for Medical and Analytical Equipment (website)—www.chemraz.com/corpnews-msesealsformedical.htm; www.chemraz.com/FluidHandling/fluidintro.htm; and www.chemraz.com/FluidHandling/fhmseseals.htm (Apr. 29, 2002).
VAT—the leader in vacuum valves—www.vat.ch/en/pages/prod_descriptions02.htm (19 pages) (Apr. 28, 2002).
International Search Report for Corresponding PCT/US03/14586.
Dickinson C. John
Jansen Frank
Murphy Daimhin P.
Hassanzadeh Parviz
Hey David A.
Moore Karla
The BOC Group Inc.
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