Substrate processing apparatus and mounter

Details Substrate processing apparatus and mounter Substrate processing apparatus and mounter

2005-07-01

2010-02-02

Banks, Derris H (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S740000, C029S743000, C269S021000

Reexamination Certificate

active

07653989

ABSTRACT:
The final-bonder is equipped with a warping correction unit that is equipped in parallel with a backup stage with a distance of about 20 mm from such backup stage, and that includes accordion pads for sucking a liquid crystal panel; the backup stage that supports, from the back, the liquid crystal panel when pressure is applied to its outer edge portion at the bonding of semiconductor components; and a pressure head that carries out final bonding of the semiconductor components onto the outer edge portion of the liquid crystal panel by applying pressure and heat to them.

REFERENCES:
patent: 2002/0093130 (2002-07-01), Behler et al.
patent: 2002/0157246 (2002-10-01), Ogimoto
patent: 0 565 278 (1993-10-01), None
patent: 5-228755 (1993-09-01), None

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