Substrate processing apparatus and method of removing particles

Liquid purification or separation – With means to add treating material – Directly applied to separator

Reexamination Certificate

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Details

C210S167010, C210S167310, C210S196000, C216S096000, C134S111000, C134S902000, C156S345180

Reexamination Certificate

active

07981286

ABSTRACT:
A liquid within a processing tank is caused to overflow, and the overflowing liquid is circulated by a circulation system. In this process, bubbles are discharged into the liquid within the processing tank. Thus, particles within the processing tank are not only carried along by a flow of the liquid but also attach to the bubbles to be carried with the bubbles outwardly of the processing tank. A dip-type substrate processing apparatus removes the particles within the processing tank in a short time with efficiency.

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Office Action issued by the Japanese Patent Office on Nov. 4, 2009 in connection with corresponding Japanese application No. 2004-331543.
English translation of Office Action issued by Japanese Patent Office on Nov. 4, 2009 in connection with Japanese application No. 2004-331543.
Japanese Office Action dated May 26, 2009 in corresponding Japanese Patent Application No. 2004-331543 (with English language translation).
Japanese Office Action dated May 26, 2009 in corresponding Japanese Patent Application No. 2004-268006 (with English language translation).
Japanese Office Action dated May 26, 2009 in corresponding Japanese Patent Application No. 2004-283465 (with English language translation).
Office Action issued by the Japanese Patent Office on Sep. 15, 2009 in connection with corresponding Japanese application No. 2004-283465.
English translation of Office Action issued by Japanese Patent Office on Sep. 15, 2009 in connection with Japanese application No. 2004-283465.

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