Substrate processing apparatus and method including a device...

Details Substrate processing apparatus and method including a device... Substrate processing apparatus and method including a device...

2005-07-05

2005-07-05

Bareford, Katherine (Department: 1762)

Coating processes

Measuring, testing, or indicating

Thickness or uniformity of thickness determined

C427S008000, C427S010000, C427S240000, C118S665000, C118S668000, C118S712000, C118S052000

Reexamination Certificate

active

06913781

ABSTRACT:
A substrate processing apparatus is provided with five inspection devices that perform inspections of different kinds to a substrate. Among the five kinds of inspections, the film quality is measured after resist coating, and before post-coating heat-treatment. As the film quality, the amount of solvent remaining in a resist film is measured. The film thickness is measured after heat-treatment following resist coating and before exposure. Meanwhile, the line width and the superposition precision are measured and macroscopic defect inspection is performed after post-development heat-treatment and before the substrate is returned to an indexer.

REFERENCES:
patent: 5393624 (1995-02-01), Ushijima
patent: 6376013 (2002-04-01), Rangarajan et al.
patent: 06-074717 (1994-03-01), None

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