Coating apparatus – Gas or vapor deposition – With treating means
Reexamination Certificate
2005-03-08
2005-03-08
Mills, Gregory (Department: 1763)
Coating apparatus
Gas or vapor deposition
With treating means
C118S728000, C118S715000, C219S444100, C392S416000, C392S418000, C156S345520
Reexamination Certificate
active
06863734
ABSTRACT:
By indirectly monitoring a warping amount of a substrate, it is possible to examine causes easily when substrate processing such as deposition is performed with nonuniform in-plane temperature of the substrate and a defect in a substrate characteristic, for example in uniformity of a film thickness, is caused. In a substrate processing apparatus for processing a substrate, a substrate holding body for holding the substrate on its surface and a resistance heater for heating the substrate through the substrate holding body are provided. Radiation thermometers for measuring temperature of the substrate holding body, which has a correlation with a warping amount of the substrate, from its rear surface side are provided to the resistance heater. The substrate holding body is provided to be rotatable with respect to the radiation thermometers so that temperature information of the substrate holding body in a circumferential direction can be obtained. A calculator as a monitor for monitoring the warping amount of the substrate having a correlation with the temperature of the substrate holding body, based on the measured values of the radiation thermometers, is provided. A command for correcting the warping amount is sent to a control means, based on the warping amount determined by the calculator, to control the resistance heater, as necessary.
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Hitachi Kokusai Electric Inc.
Kackar Ram N
Mills Gregory
Oliff & Berridg,e PLC
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