Substrate processing apparatus and method

Cleaning and liquid contact with solids – Apparatus – With plural means for supplying or applying different fluids...

Reexamination Certificate

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C134S184000, C134S186000

Reexamination Certificate

active

07392814

ABSTRACT:
Pure water dissolving nitrogen gas and containing microbubbles is supplied to a substrate. Since microbubbles are very minute in size and also have the electrostatic property, they can efficiently adsorb particles on the substrate surface or in the pure water. Further, since pure water dissolving nitrogen gas is unlikely to be charged, the pure water itself never carries new particles from each component of the apparatus. These functions allow efficient particle removal from the substrate surface or the liquid.

REFERENCES:
patent: 6138698 (2000-10-01), Tanaka et al.
patent: 6454867 (2002-09-01), Bourdat
patent: 6796315 (2004-09-01), Lu et al.
patent: 7104268 (2006-09-01), Wu et al.
patent: 2001/0023700 (2001-09-01), Drayer et al.
patent: 2002/0011253 (2002-01-01), Puri et al.
patent: 2003/0205559 (2003-11-01), Hansen et al.
patent: 2004/0134513 (2004-07-01), Lu et al.
patent: 2004/0152319 (2004-08-01), Yamagata et al.
patent: 2004/0226654 (2004-11-01), Hongo et al.
patent: 7-58078 (1995-03-01), None
patent: 9-69508 (1997-03-01), None
patent: 2005-45159 (2005-02-01), None
patent: 2005-93733 (2005-04-01), None

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