Cleaning and liquid contact with solids – Apparatus – With plural means for supplying or applying different fluids...
Reexamination Certificate
2008-07-01
2008-07-01
Perrin, Joseph L (Department: 1792)
Cleaning and liquid contact with solids
Apparatus
With plural means for supplying or applying different fluids...
C134S184000, C134S186000
Reexamination Certificate
active
07392814
ABSTRACT:
Pure water dissolving nitrogen gas and containing microbubbles is supplied to a substrate. Since microbubbles are very minute in size and also have the electrostatic property, they can efficiently adsorb particles on the substrate surface or in the pure water. Further, since pure water dissolving nitrogen gas is unlikely to be charged, the pure water itself never carries new particles from each component of the apparatus. These functions allow efficient particle removal from the substrate surface or the liquid.
REFERENCES:
patent: 6138698 (2000-10-01), Tanaka et al.
patent: 6454867 (2002-09-01), Bourdat
patent: 6796315 (2004-09-01), Lu et al.
patent: 7104268 (2006-09-01), Wu et al.
patent: 2001/0023700 (2001-09-01), Drayer et al.
patent: 2002/0011253 (2002-01-01), Puri et al.
patent: 2003/0205559 (2003-11-01), Hansen et al.
patent: 2004/0134513 (2004-07-01), Lu et al.
patent: 2004/0152319 (2004-08-01), Yamagata et al.
patent: 2004/0226654 (2004-11-01), Hongo et al.
patent: 7-58078 (1995-03-01), None
patent: 9-69508 (1997-03-01), None
patent: 2005-45159 (2005-02-01), None
patent: 2005-93733 (2005-04-01), None
Arai Kenichiro
Hasegawa Koji
Higuchi Ayumi
Tanaka Masato
Dainippon Screen Mfg. Co,. Ltd.
Ostrolenk Faber Gerb & Soffen, LLP
Perrin Joseph L
LandOfFree
Substrate processing apparatus and method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Substrate processing apparatus and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate processing apparatus and method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2753761