Substrate processing apparatus and method

Details Substrate processing apparatus and method Substrate processing apparatus and method

1998-05-28

2000-10-31

Lund, Jeffrie R

Coating apparatus

Gas or vapor deposition

With treating means

118715, 118725, 4272481, 42725523, 432241, C23C 1600

Patent

active

061396427

ABSTRACT:
A substrate processing apparatus and method restrains outside air and gas-phase backward flow from entering the inside of a reaction chamber during a time period that the inside of the reaction chamber is opened to the outside through a substrate carrying-in/carrying-out opening. The substrate processing apparatus can comprise, for example, a vertical CVD apparatus having a gas supply system and a bypass line. The gas supply system supplies inert gas to a space between an outer tube and an inner tube of a reaction furnace during a boat loading period and a boat unloading period. The bypass line exhausts the atmosphere from the reaction chamber by a slow exhaust operation during the boat loading period and the boat unloading period.

REFERENCES:
patent: 5029554 (1991-07-01), Miyashita et al.
patent: 5088922 (1992-02-01), Kakizaki et al.
patent: 5246500 (1993-09-01), Samata et al.
patent: 5271732 (1993-12-01), Yokokawa
patent: 5316794 (1994-05-01), Carlson et al.
patent: 5330352 (1994-07-01), Watanabe et al.
patent: 5365772 (1994-11-01), Ueda et al.
patent: 5370371 (1994-12-01), Miyagi et al.
patent: 5433784 (1995-07-01), Miyagi et al.
patent: 5445521 (1995-08-01), Yamaguchi et al.
patent: 5462397 (1995-10-01), Iwabuchi
patent: 5540782 (1996-07-01), Miyagi et al.
patent: 5554226 (1996-09-01), Okase et al.
patent: 5562383 (1996-10-01), Iwai et al.
patent: 5578132 (1996-11-01), Yamaga et al.
patent: 5697749 (1997-12-01), Iwabuchi et al.
patent: 5750436 (1998-05-01), Yamaga et al.
patent: 5777300 (1998-07-01), Homma et al.
patent: 5888579 (1999-03-01), Lun

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