Substrate processing apparatus and method

Details Substrate processing apparatus and method Substrate processing apparatus and method

2007-04-24

2007-04-24

Wilkins, III, Harry D. (Department: 1742)

Electrolysis: processes, compositions used therein, and methods

Electrolytic erosion of a workpiece for shape or surface...

Gap maintenance or defined tool-workpiece gap

C205S668000, C204S199000, C204S242000

Reexamination Certificate

active

10485177

ABSTRACT:
A substrate processing apparatus can perform an electrolytic processing, which is different from a common, conventional etching, to remove (clean off) a conductive material (film) formed on or adhering to a bevel portion, etc. of a substrate, or process a peripheral portion of a substrate through an electrochemical action. The substrate processing apparatus includes: an electrode section having a plurality of electrodes which are laminated with insulators being interposed, and having a holding portion which is to be opposed to a peripheral portion of a substrate; an ion exchanger disposed in the holding portion of the electrode section; a liquid supply section for supplying a liquid to the holding position of the electrode section; and a power source for applying a voltage to the electrodes of the electrode section so that the electrodes alternately have different polarities.

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