Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...
Reexamination Certificate
2006-02-17
2009-06-09
Culbert, Roberts P (Department: 1792)
Cleaning and liquid contact with solids
Processes
Including application of electrical radiant or wave energy...
C427S255500
Reexamination Certificate
active
07543593
ABSTRACT:
A substrate processing apparatus is provided. The apparatus includes a plurality of fluid suppliers61, 61, 63for supplying different processing fluids. In processing a wafer W, the substrate processing apparatus moves the fluid suppliers61, 62, 63along the peripheral part of the wafer W relatively. The fluid suppliers61, 62, 63are arranged in a direction extending from the circumference of the wafer W to its inside. With the arrangement, the apparatus is capable of stable processing of the wafer W in spite of rotating the wafer W at a low speed. Further, it is possible to improve a throughput of the apparatus in resist processing.
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Kuroda Osamu
Nishida Tatsuya
Orii Takehiko
Culbert Roberts P
SMith, Gambrell & Russell, LLP
Tokyo Electron Limited
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