Substrate processing apparatus

Photography – Fluid-treating apparatus – Fluid application to one side only of photographic medium

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C118S052000, C118S058000

Reexamination Certificate

active

07600933

ABSTRACT:
A substrate processing apparatus includes a substrate holding stage to hold a substrate having a surface facing up, the substrate having an exposed and developed resist pattern over the surface, a rotation driving mechanism to rotate the substrate holding stage around a vertical axis, a solvent vapor discharge nozzle having a discharge hole capable of discharging solvent vapor to swell the resist pattern onto the surface of the substrate and a vacuum opening capable of absorbing the solvent vapor discharged from the discharge hole, and a moving mechanism to move the solvent vapor discharge nozzle from an edge to a center of the substrate. The substrate is rotated around the vertical axis while moving the solvent vapor discharge nozzle from the edge to the center of the substrate, discharging the solvent vapor from the discharge hole, to supply the solvent vapor over the substrate in a spiral manner.

REFERENCES:
patent: 6248168 (2001-06-01), Takeshita et al.
patent: 2006/0237127 (2006-10-01), Inatomi
patent: 2007/0238028 (2007-10-01), Inatomi
patent: 2005-19969 (2005-01-01), None
patent: 2005-310953 (2005-11-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Substrate processing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate processing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate processing apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4054173

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.