Abrading – Machine – Reciprocating tool
Reexamination Certificate
2008-05-06
2008-05-06
Shakeri, Hadi (Department: 3723)
Abrading
Machine
Reciprocating tool
C451S065000, C451S006000, C451S173000, C451S444000
Reexamination Certificate
active
10364359
ABSTRACT:
A substrate processing apparatus has a polishing tape and a polishing head for pressing the polishing tape against a peripheral portion of a semiconductor wafer. The substrate processing apparatus polishes the wafer due to sliding contact of the polishing tape and the wafer. The polishing head has an elastic body for supporting the polishing tape. The substrate processing apparatus has an air cylinder for pressing the polishing head so that the elastic body of the polishing head presses the polishing tape against the predetermined portion of the wafer under a constant force.
REFERENCES:
patent: 4031668 (1977-06-01), Lasko et al.
patent: 4514937 (1985-05-01), Gehrung et al.
patent: 5128281 (1992-07-01), Dyer et al.
patent: 5209027 (1993-05-01), Ishida et al.
patent: 5289661 (1994-03-01), Jones et al.
patent: 5431592 (1995-07-01), Nakata
patent: 5514025 (1996-05-01), Hasegawa et al.
patent: 5980368 (1999-11-01), Chang et al.
patent: 6132289 (2000-10-01), Labunsky et al.
patent: 6306014 (2001-10-01), Walker et al.
patent: 6402596 (2002-06-01), Hakomori et al.
patent: 6439967 (2002-08-01), Carpenter
patent: 6475293 (2002-11-01), Moinpour et al.
patent: 2002/0142707 (2002-10-01), Shimada et al.
patent: 2003/0139049 (2003-07-01), Nakamura et al.
patent: 2004/0185751 (2004-09-01), Nakanishi et al.
patent: 2005/0250423 (2005-11-01), Nakamura et al.
patent: 5-329759 (1993-12-01), None
Ishii You
Nakamura Kenro
Nakanishi Masayuki
Ebara Corporation
Shakeri Hadi
Wenderoth , Lind & Ponack, L.L.P.
LandOfFree
Substrate processing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Substrate processing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate processing apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3946124