Cleaning and liquid contact with solids – Apparatus – With plural means for supplying or applying different fluids...
Reexamination Certificate
2008-07-29
2008-07-29
Stinson, Frankie L (Department: 1792)
Cleaning and liquid contact with solids
Apparatus
With plural means for supplying or applying different fluids...
C134S148000, C134S153000, C134S200000, C134S901000
Reexamination Certificate
active
11616075
ABSTRACT:
The substrate processing apparatus has an enclosure structure enclosing a substrate support member to define a processing space. The enclosure structure has an opening closed by a shutter. A processing fluid supply unit, which supplies processing fluid, such as chemical liquid, is accommodated in a housing. The processing fluid supply unit accommodated in the housing is advanced into the processing space through the opening of the enclosure structure to feed the processing fluid onto the substrate supported by the substrate support member.
REFERENCES:
patent: 3953265 (1976-04-01), Hood
patent: 4021278 (1977-05-01), Hood et al.
patent: 4339297 (1982-07-01), Aigo
patent: 4350562 (1982-09-01), Bonu
patent: 4485758 (1984-12-01), Peugh et al.
patent: 4544446 (1985-10-01), Cady
patent: 4718975 (1988-01-01), Bowling et al.
patent: 5209180 (1993-05-01), Shoda et al.
patent: 5395482 (1995-03-01), Onda et al.
patent: 5395649 (1995-03-01), Ikeda
patent: 5472502 (1995-12-01), Bachelder
patent: 5693149 (1997-12-01), Passer et al.
patent: 5715612 (1998-02-01), Schwenkler
patent: 5762708 (1998-06-01), Motoda et al.
patent: 5927303 (1999-07-01), Miya et al.
patent: 5975097 (1999-11-01), Yonemizu et al.
patent: 5979475 (1999-11-01), Satoh et al.
patent: 6013316 (2000-01-01), Cubit
patent: 6059891 (2000-05-01), Kubota et al.
patent: 6090205 (2000-07-01), Sakai et al.
patent: 6273104 (2001-08-01), Shibara et al.
patent: 6431190 (2002-08-01), Oka et al.
patent: 6446643 (2002-09-01), Curtis et al.
patent: 6497241 (2002-12-01), Pascal
patent: 6588437 (2003-07-01), Higashi
patent: 6601596 (2003-08-01), Liang et al.
patent: 6629539 (2003-10-01), Yanagita et al.
patent: 7000623 (2006-02-01), Welsh et al.
patent: 61-152020 (1986-07-01), None
patent: 8-78368 (1996-03-01), None
Kuroda Osamu
Orii Takehiko
Smith , Gambrell & Russell, LLP
Stinson Frankie L
Tokyo Electron Limited
LandOfFree
Substrate processing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Substrate processing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate processing apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3909827